The University of Science and Technology of China (USTC) offers an exciting fully-funded Research Internship Program 2026 for international students and young researchers. Based in the vibrant city of Hefei, China, this program gives participants the opportunity to work in state-of-the-art laboratories under the guidance of expert mentors across a wide range of research disciplines, from artificial intelligence and physics to biology and materials science.
Key Details
- Host Institution: University of Science and Technology of China (USTC), Hefei, China
- Program Type: Non-degree Research Internship (Fully Funded)
- Duration: 3 months to 1 year
- Deadline: Rolling / Open (apply at least 3 months before desired start date)
- Benefits: Stipend (amount depends on fellowship level: Level A, B, or C), free accommodation on campus, and participation in cultural programs
- Eligibility: International students aged 18–40 holding a valid non-Chinese passport; applicants should be 3rd/4th year undergraduate students or enrolled in a graduate (Master’s/PhD) program
- Research Fields: AI & Computer Science, Physics, Chemistry, Biology, Materials Science, Environmental Science, Mathematics, and more
- Application Steps: (1) Contact a USTC professor in your field and get their approval; (2) Register online via the USTC International College portal; (3) Select “Non-degree program → Research Internship”; (4) Complete the application form and upload required documents; (5) Submit application
- How to Apply: Apply via USTC International College official portal
USTC consistently ranks among China’s top universities for science and technology research. This internship is an excellent gateway to cutting-edge research experience in Asia, with the added benefit of cultural immersion. Since applications are rolling, interested candidates should act as soon as possible to identify a suitable research supervisor and begin the application process.
Always verify deadlines and details on the official USTC International College website before applying.
